APL Hofstetter PCB GmbH

APL Hofstetter PCB GmbH is a subsidiary of Hofstetter PCB AG in Küssnacht am Rigi, Switzerland.
APL Hofstetter PCB GmbH is a service company [job plater] specialized in immersion tin (iSn), iSn refresh and FinalClean (ENIG/ ENEPIG). The location of APL Hofstetter is in Lörrach (Germany). APL Hofstetter cooperates with all kind of printed circuit board (pcb) manufactures, electronic manufacturing services (EMS)-industries, trading companies (national/ international), and worldwide original equipment manufacturer (OEM).

The target of APL Hofstetter is to create added value for the customers through smart surface coating and service. APL Hofstetter fulfills this high claim by producing high level solutions with latest production equipment as thinking and acting ahead.

Our customers already represent the "who's who" of the European electronic- and pcb- industry; increasingly, orders are also being placed by customers from the Far East.

The APL Hofstetter technology stands in harmony with social and political guidelines regarding quality and environmental protection. APL Hofstetter will not only live up to these superimposed guidelines through our quality- and environmental management; we will also proctively contribute to sustainable preservation and improvement of ground, air, and water resources.


2017 acquisition of APL Oberflächentechnik GmbH by Hofstetter PCB AG (Switzerland). Takeover of the operative business by the subsidiary APL Hofstetter PCB GmbH.

2014 Introduction of the new cleaning and activating process FinalClean.

2013 Setting the course for new surface solutions – APL invests in new surface processes and the corresponding building infrastructure.

2010 Introduction and setting up of our stock concept for “just in time” coating of printed circuit boards. In order to introduce the concept, APL’s first Technology Day takes place in December 2010.

2008 Production of smarttin® begins – the end of one era and the birth of a new era. Europe’s largest and most state-of-the-art chemical tin process is officially released by ATOTECH.
APL receives a distinction from the Baden-Württemberg Ministry of the Environment in the framework of the Umweltpreis für Unternehmen 2008 [Environment Award for Companies 2008].

2006 Modification of the building infrastructure begins to take form. In 2007, the production plant co-developed by us in conjunction with ATOTECH Deutschland is delivered and set up.

2002 Approval by Bosch; in this year too, solder mask coating is discontinued – other automobile electronics manufacturers such as Siemens-VDO, Harmann-Becker, Hella and so on use APL’s lead-free tin coating in the meanwhile. 2005 Two partners pull out of APL Oberflächentechnik GmbH. Walter Tastl takes over their shares and becomes the sole shareholder and director.

1998 After more than four years of practical trials, our chemical tin layering is approved by Siemens. Further approvals from renowned companies follow. 

Walter Tastl and two other partners take over the shares of APL CLAREXI Deutschland GmbH in an MBO; APL now runs the company under the new name of APL Oberflächentechnik GmbH.

1996 APL receives a number of distinctions for its development work, among others, the 1996 Idea Competition initiated by Sonderabfallentsorgungs GmbH Baden Württemberg and the Wuppertal Institute for Climate, Environment and Energy. APL also received a distinction for “exemplary performance in the development of new products and processes” awarded by the Minister of Economics of the State of Baden-Württemberg in the framework of the 1996 Dr. Rudolf Eberle Prize.

1994 APL is the first company worldwide to be able to chemically tin plate printed circuit boards in a horizontal technical system. 1995 The first chemical tin production plant (working in a horizontal process) starts operation. Renowned manufacturers in the electronics branch such as Siemens, Hella, Kathrein, Alcatel, and others receive deliveries of the chemical tin surface.

1989 Founding of APL Clarexi Deutschland GmbH as a solder resist mask service. 1992 The beginning of the development of chemical tin in terms of process technology. 1993 The introduction of the chemical tin service.